Light-emitting device and light-emitting module with frame and covering member

ABSTRACT

A light emitting device that includes a plurality of element structures, a frame, and a covering member. Each of the plurality of element structures includes a light emitting element. The frame surrounds the plurality of element structures. The covering member is disposed on an inner side of the frame. The covering member is disposed between the frame and an element structure of the plurality of element structures adjacent to the frame and between adjacent element structures of the plurality of element structures. An upper surface and a lower surface of each of the plurality of element structures are exposed from the covering member.

CROSS-REFERENCE TO RELATED APPLICATIONS

The present application is a continuation application of U.S. patentapplication Ser. No. 17/024,704, filed Sep. 18, 2020, which claimspriority under 35 U.S.C. § 119 to Japanese Patent Application No.2019-172787, filed Sep. 24, 2019, the contents of which are incorporatedherein by reference in their entirety.

BACKGROUND OF THE INVENTION 1. Field of the Invention

The present disclosure relates to a method of manufacturing alight-emitting device and a method of manufacturing a light-emittingmodule.

2. Description of Related Art

A light-emitting device having a plurality of light-emitting surfaceshas been known. For example, Japanese Unexamined Patent ApplicationPublication No. 2016-27620 describes a light-emitting device thatincludes a plurality of light-emitting elements, a light-transmissivemember that covers upper surfaces of the light-emitting elements, and alight-reflective member that integrally covers lateral surfaces of thelight-emitting elements.

SUMMARY OF THE INVENTION

To densely dispose a plurality of light-emitting surfaces, the structureof such a light-emitting device has room for further improvement.Certain embodiments according to the present disclosure advantageouslyprovide a method of manufacturing a light-emitting device that has smallintervals between adjacent ones of the light-emitting surfaces and amethod of manufacturing a light-emitting module.

A method of manufacturing a light-emitting device according to oneembodiment of the present disclosure includes: providing a plurality ofelement structures, each of which includes a submount substrate, alight-emitting element, and a light-transmissive member in this order;disposing the plurality of element structures such that thelight-transmissive members face a sheet member; and forming a coveringmember on the sheet member to cover at least a portion of each oflateral surfaces of the submount substrate of each of the elementstructures.

A method of manufacturing a light-emitting module according to anotherembodiment of the present disclosure includes providing a light-emittingdevice using the method of manufacturing the light-emitting device, anddisposing the light-emitting device such that the submount substratesface a module substrate.

A method of manufacturing a light-emitting device according to certainembodiments of the present disclosure allows for manufacturing alight-emitting device that has small intervals between adjacent ones ofthe light-emitting surfaces. A method of manufacturing a light-emittingmodule according to certain embodiments of the present disclosure allowsfor manufacturing a light-emitting module that has small intervalsbetween adjacent ones of the light-emitting surfaces can be manufacturedby.

BRIEF DESCRIPTION OF THE DRAWINGS

A more complete appreciation of the invention and many of the attendantadvantages thereof will be readily obtained as the same becomes betterunderstood by reference to the following detailed description whenconsidered in connection with the accompanying drawings, wherein:

FIG. 1A is a perspective view schematically illustrating the structureof a light-emitting module including a light-emitting device accordingto a first embodiment.

FIG. 1B is a plan view schematically illustrating the structure of thelight-emitting module including the light-emitting device according tothe first embodiment.

FIG. 1C is a schematic cross-sectional view taken along line IC-IC ofFIG. 1B.

FIG. 1D is a schematic cross-sectional view taken along line ID-ID ofFIG. 1B.

FIG. 1E is a cross-sectional view schematically illustrating thestructure of the light-emitting device according to the firstembodiment.

FIG. 1F is a bottom view schematically illustrating the structure of thelight-emitting device according to the first embodiment.

FIG. 2 is a flowchart illustrating a method of manufacturing thelight-emitting device according to the first embodiment.

FIG. 3 is a flowchart illustrating a method of manufacturing thelight-emitting module according to the first embodiment.

FIG. 4A is a schematic cross-sectional view illustrating mountinglight-emitting elements in providing a first element structure in themethod of manufacturing the light-emitting device according to the firstembodiment.

FIG. 4B is a schematic cross-sectional view illustrating disposinglight-transmissive members in the providing the first element structurein the method of manufacturing the light-emitting device according tothe first embodiment.

FIG. 4C is a schematic cross-sectional view illustrating forming thefirst element structures in the providing the first element structure inthe method of manufacturing the light-emitting device according to thefirst embodiment.

FIG. 4D is a schematic cross-sectional view illustrating forming a framein the method of manufacturing the light-emitting device according tothe first embodiment.

FIG. 4E is a schematic cross-sectional view illustrating mounting thefirst element structures in the method of manufacturing thelight-emitting device according to the first embodiment.

FIG. 4F is a schematic cross-sectional view illustrating forming acovering member in the method of manufacturing the light-emitting deviceaccording to the first embodiment.

FIG. 4G is a schematic cross-sectional view illustrating removing asheet member in the method of manufacturing the light-emitting deviceaccording to the first embodiment.

FIG. 4H is a schematic cross-sectional view illustrating disposing thelight-emitting device in the method of manufacturing the light-emittingmodule according to the first embodiment.

FIG. 4I is a schematic plan view illustrating the mounting the firstelement structure in the method of manufacturing the light-emittingdevice according to the first embodiment.

FIG. 4J is a schematic plan view illustrating forming the coveringmember in the method of manufacturing the light-emitting deviceaccording to the first embodiment.

FIG. 4K is a schematic plan view illustrating mounting thelight-emitting device in the method of manufacturing the light-emittingmodule according to the first embodiment.

FIG. 5A is a cross-sectional view schematically illustrating thestructure of a light-emitting module including a light-emitting deviceaccording to another embodiment 1.

FIG. 5B is a plan view schematically illustrating the structure of alight-emitting module including a light-emitting device according toanother embodiment 2.

FIG. 5C is a plan view schematically illustrating the structure of alight-emitting module including a light-emitting device according toanother embodiment 3.

FIG. 5D is a plan view schematically illustrating the structure of alight-emitting module including a light-emitting device according toanother embodiment 4.

FIG. 5E is a plan view schematically illustrating the structure of alight-emitting module including a light-emitting device according toanother embodiment 5.

FIG. 5F is a plan view schematically illustrating the structure of alight-emitting module including a light-emitting device according toanother embodiment 6.

FIG. 5G is a plan view schematically illustrating the structure of alight-emitting module including a light-emitting device according toanother embodiment 7.

FIG. 5H is a plan view schematically illustrating the structure of alight-emitting module including a light-emitting device according toanother embodiment 8.

FIG. 6A is a plan view schematically illustrating the structure of alight-emitting module including a light-emitting device according toanother embodiment 9.

FIG. 6B is a schematic sectional view taken along line VIB-VIB of FIG.6A.

FIG. 6C is a schematic bottom view illustrating the structure of thelight-emitting device according to the another embodiment 9 shown inFIG. 6A.

DETAILED DESCRIPTION OF EMBODIMENTS

Certain embodiments of the present disclosure are described below withreference to the drawings. The embodiments described below are examplesof a method of manufacturing a light-emitting device, a method ofmanufacturing a light-emitting module, a light-emitting device, and alight-emitting module for giving a concrete form to the technical ideasof the present invention, but the present invention is not limited tothe embodiments described below. Unless specifically stated otherwise,the sizes, materials, shapes, and relative positions of constituentcomponents described in the embodiments described below are not intendedto limit the scope of the present invention, but are rather merelyexamples. Sizes or positional relationships of members illustrated inthe drawings may be exaggerated in order to clarify the descriptions.The number of the light-emitting elements illustrated in each drawing isan example to facilitate understanding of the structure.

First Embodiment

FIG. 1A is a perspective view schematically illustrating the structureof a light-emitting module including a light-emitting device accordingto a first embodiment. FIG. 1B is a plan view schematically illustratingthe structure of the light-emitting module including the light-emittingdevice according to the first embodiment. FIG. 1C is a schematiccross-sectional view taken along line IC-IC of FIG. 1B. FIG. 1D is aschematic cross-sectional view taken along line ID-ID of FIG. 1B. FIG.1E is a cross-sectional view schematically illustrating the structure ofthe light-emitting device according to the first embodiment. FIG. 1F isa bottom view schematically illustrating the structure of thelight-emitting device according to the first embodiment.

A light-emitting module 200 includes a light-emitting device 100 and amodule substrate 80. The light-emitting device 100 is disposed on themodule substrate 80.

Light-Emitting Device

The light-emitting device 100 will be described below.

The light-emitting device 100 includes a plurality of element structures15 each of which includes a submount substrate 10, a light-emittingelement 20, and a light-transmissive member 30 that are layered in thisorder (hereinafter referred to as first element structures 15 asappropriate) and a covering member 40 that covers lateral surfaces ofeach of the first element structures 15 to hold the first elementstructures 15.

The light-emitting device 100 mainly includes the submount substrates10, the light-emitting elements 20, protective elements 25, thelight-transmissive members 30, the covering member 40, and a frame 50.

Configurations of the light-emitting device 100 will be described below.

The light-emitting element 20 and the protective element 25 are disposedon the submount substrate 10. The submount substrate 10 has, forexample, a substantially elongated-rectangular shape in a plan view. Thesubmount substrate 10 includes a base portion 2 and wirings toelectrically connect the light-emitting device 100 to externalcomponents. More specifically, the submount substrate 10 includes thebase portion 2, and the wirings that are disposed in the base portion 2.The wirings include first wiring portions 3, inner wiring portions 4,and second wiring portions 5.

A preferable material for the base portion 2 includes an insulatingmaterial that is unlikely to transmit light such as light emitted fromthe light-emitting element 20 and external light. For example, ceramicssuch as alumina, aluminum nitride, and mullite, thermoplastic resinssuch as polyamides (PA), polyphthalamide (PPA), polyphenylene sulfide(PPS), and liquid crystal polymers, and other resins such as epoxyresins, silicone resins, modified epoxy resins, urethane resins, andphenolic resins can be used. Among these materials, ceramics having highheat dissipation performance and are preferably used.

In the light-emitting device 100, the distance between adjacent ones ofthe submount substrates 10 is preferably 0.05 mm or more and 0.2 mm orless. Then, the covering member 40 disposed between adjacent ones of thesubmount substrates 10 has a thickness of 0.05 mm or more and 0.2 mm orless. Accordingly, adjacent ones of the submount substrates 10 can bebonded to be close to each other. The covering member 40 disposedbetween adjacent ones of the submount substrates 10 can reduce theinfluence of thermal stress caused due to the difference of thermalexpansion coefficient.

The first wiring portions 3 are disposed on an upper surface of the baseportion 2 and are electrically connected to the light-emitting element20 and the protective element 25. The second wiring portions 5 aredisposed on a lower surface of the base portion 2 and electricallyconnected to an external power supply, serving as an external electrodefor the light-emitting device 100. The inner wiring portions 4 aredisposed inside the base portion 2 so as to penetrate the base portion2, and electrically connect the first wiring portions 3 and the secondwiring portions 5. The light-emitting device may not include theprotective elements 25.

For example, a metal such as Fe, Cu, Ni, Al, Ag, Au, Pt, Ti, W, and Pd,or an alloy containing at least one of these metals can be used for eachof the first wiring portions 3, the inner wiring portions 4, and thesecond wiring portions 5. The first wirings 3, the inner wiring portions4, and the second wiring portions 5 can be formed by, for example,electroplating, electroless plating, vapor deposition, and sputtering.

The light-emitting element 20 is a semiconductor element that emit lightwhen voltage is applied. An appropriate shape, size, and the like of thelight-emitting element 20 can be selected. The emission color of thelight-emitting element 20 can be selected from any appropriatewavelength according to the purpose. Examples of a blue light-emittingelement 20 (light with wavelengths of 430 nm to 500 nm) and a greenlight-emitting element 20 (light with wavelengths of 500 nm to 570 nm)include a light-emitting element including a nitride semiconductor(In_(X)Al_(Y)Ga_(1-X-Y)N, where 0≤X, 0≤Y, and X+Y≤1), GaP, and the like.For a red light-emitting element 20 (light with wavelengths of 610 nm to700 nm), a nitride semiconductor element, GaAlAs, AlInGaP, and the likecan be used.

The light-emitting element 20 preferably has positive and negativeelement electrodes 23 on a single surface. This allows thelight-emitting element 20 to be flip-chip mounted on the first wiringportions 3 of the submount substrate 10 using electroconductiveadhesives. Examples of the electroconductive adhesive materials includeeutectic solder, electroconductive paste, and bumps.

Examples of the protective element 25 include a Zener diode. Theprotective element 25 is provided with positive and negative elementelectrodes 27 on a surface of the protective element 25, and isflip-chip mounted on the first wiring portions 3 of the submountsubstrate 10 using the electroconductive adhesives.

The light-transmissive member 30 is made of, for example, resins, glass,or inorganic materials. The light-transmissive member 30 is disposed onthe light-emitting element 20. The light-transmissive member 30preferably has an upper surface that is larger than an upper surface ofthe light-emitting element 20.

In the light-emitting device 100, the distance between adjacent ones ofthe light-transmissive members 30 that are exposed on an upper surfaceof the light-emitting device 100 is preferably 0.2 mm or less. With thedistance between the light-transmissive members 30 being 0.2 mm or less,for example, the light-emitting device 100 can serve as a compact lightsource for use in an adaptive driving beam (ADB) for vehicles, so thatthe size of the headlight lens can be decreased. Accordingly, a primarylens in optics can be omitted, and loss of light while passing throughthe headlight lens can be decreased. For further reduction in size of alight source, the distance between adjacent ones of thelight-transmissive members 30 is more preferably 0.1 mm or less, furtherpreferably 0.05 mm or less. For ease of manufacturing the light-emittingdevice 100, the distance between adjacent ones of the light-transmissivemembers 30 is preferably 0.03 mm or more.

The light-transmissive member 30 can have various planer shapes such asa circular shape, an elliptic shape, a square, or a polygonal shape suchas a hexagonal shape. Among these shapes, the light-transmissive member30 preferably has a rectangular shape such as a square shape or anelongated-rectangular shape, more preferably has a similar shape to theplaner shape of the light-emitting element 20.

The light-transmissive member 30 can contain a wavelength conversionmaterial. Examples of the wavelength conversion material includephosphors. Examples of the light-transmissive member 30 that containsphosphors include a sintered body of phosphors and a mixture of phosphorpowder and other materials such as resins, glass, ceramics, and otherinorganic substances. The light-transmissive member 30 can have astructure in which a resin layer containing a phosphor or a glass layercontaining a phosphor is disposed on a surface of a molded body of aresin, a glass, or a ceramic. The light-transmissive member 30 cancontain fillers such as diffusing materials depending on the purpose. Inthe case of containing fillers such as diffusing materials, an inorganicmaterial such as resins, glass, ceramics, or the like that containsfillers can be used for the light-transmissive member 30. Alternatively,a structure in which a resin layer containing fillers or a glass layercontaining fillers is disposed on a surface of a molded body of a resin,a glass, or a ceramic can be used for the light-transmissive member 30.

A phosphor known in the art can be used for the phosphor. Examples ofgreen-light emitting phosphors include yttrium-aluminum-garnet basedphosphors (for example, Y₃(Al,Ga)₅O₁₂:Ce), lutetium-aluminum-garnetbased phosphors (for example, Lu₃(Al,Ga)₅O₁₂:Ce),terbium-aluminum-garnet based phosphors (for example,Tb₃(Al,Ga)₅O₁₂:Ce), silicate based phosphors (for example, (Ba,Sr)₂SiO₄:Eu), chlorosilicate based phosphors (for example,Ca₈Mg(SiO₄)₄C₁₂:Eu), β-SiAlON based phosphors (for example,Si_(6-z)Al_(z)O_(z)N_(8-z):Eu (0<z<4.2)), SGS based phosphors (forexample, SrGa₂S₄:Eu). Examples of yellow-light emitting phosphorsinclude α-SiAlON phosphors (for example, Mz(Si,Al)₁₂(O,N)₁₆ (where0<z≤2, and M is Li, Mg, Ca, Y, or a lanthanoid element except for La andCe). Some of the green-light emitting phosphors described above alsoemit yellow light.

Also, for example, yellow light can be obtained by substituting a partof Y in an yttrium-aluminum-garnet phosphor with Gd to shift itsemission peak wavelength to a longer wavelength. Some of these phosphorscan emit orange light. Examples of red-light emitting phosphors includenitrogen-containing calcium aluminosilicate based (CASN or SCASN)phosphors (for example, (Sr,Ca)AlSiN₃:Eu), and BSESN based phosphors(for example, (Ba,Sr,Ca)₂Si₅N₈:Eu). The examples of red-light emittingphosphors also include manganese-activated fluoride based phosphors(phosphors represented by the general formula (I) A₂[M_(1-a)Mn_(a)F₆](in the general formula (I), the symbol “A” is at least one selectedfrom the group consisting of K, Li, Na, Rb, Cs, and NH₄, M is at leastone element selected from the group consisting of the Group IV elementsand the Group XIV elements, and the symbol “a” satisfies 0<a<0.2)).Specific examples of the manganese-activated fluoride phosphors includemanganese-activated potassium fluorosilicate phosphors (for example,K₂SiF₆:Mn).

A diffusing material known in the art can be used for the diffusingmaterial. For example, barium titanate, titanium oxide, aluminum oxide,or silicon oxide can be used.

When using a resin for the light-transmissive member 30 or for a binderfor phosphors and diffusing materials, examples of a material of theresin include thermosetting resins such as epoxy resins, modified epoxyresins, silicone resins, and modified silicone resins.

The covering member 40 is disposed to surround the plurality of firstelement structures 15. A resin material is preferably used for thecovering member 40. The covering member 40 is, for example, made of alight-reflective resin containing the reflective material and coverslateral surfaces of the first element structures 15. That is, thecovering member 40 covers lateral surfaces of each submount substrate10, lateral surfaces of each light-emitting element 20, and lateralsurfaces of each light-transmissive member 30. The covering member 40 isdisposed between adjacent ones of the first element structures 15 tocover outer lateral surfaces of each of the first element structures 15.When the light-emitting device 100 includes the frame 50, the coveringmember 40 is disposed inward of the frame 50 between the frame 50 andthe first element structures 15, and between the first elementstructures 15.

As shown in FIG. 1E, the covering member 40 covers portions of each ofthe first element structures 15, from the lateral surfaces of thelight-transmissive member 30 to the lateral surfaces of the base portion2 of the submount substrate 10, and the lateral surfaces and lowersurfaces of the second wiring portions 5 are exposed from the coveringmember 40. The lower surface of the base portion 2 (that is, a surfaceof the base portion 2 opposite to a surface on which the light-emittingelement 20 is disposed), the lateral surfaces of the second wiringportions 5, and the lower surfaces of the second wiring portions 5 areexposed from the covering member 40. The covering member 40 can coverthe lateral surfaces of the second wiring portions 5 such that the lowersurfaces of the second wiring portions 5 is exposed.

The covering member 40 cover at least a portion of the lateral surfaceof the submount substrate 10 of each of the first element structures 15.In view of reflection of light, the covering member 40 preferably coversat least upper half portions of the lateral surfaces of the submountsubstrate 10, more preferably covers the whole of the lateral surfacesof the submount substrate 10. In an example, the covering member 40covers substantially the whole of the lateral surfaces of the submountsubstrate 10 and is disposed between the frame 50 and the submountsubstrate 10 to have an inclined surface.

Examples of resin materials for the covering member 40 include the resinmaterials described above as examples of a resin material for thelight-transmissive member 30. Examples of light-reflective materials tobe contained in the resin for the covering member 40 include titaniumoxide, silica, silicon oxide, aluminum oxide, zirconium oxide, magnesiumoxide, potassium titanate, zinc oxide, silicon nitride, and boronnitride. Among these materials, titanium oxide, which has a relativelyhigh refractive index, is preferably used in view of reflection oflight.

The frame member 50 surrounds the plurality of first element structures15 and holds the covering member 40. The frame 50 has, for example, anelongated-rectangular shape in a plan view. The frame 50 surrounds thefirst element structures 15. The expression “the elongated-rectangularshape” of the frame 50 as used herein refers to an elongated-rectangularframe shape, that is, an elongated-rectangular annular shape. The frame50 has a height from the light-emitting surface of the light-emittingdevice 100 to approximately the center of the base portion 2 of thesubmount substrate 10.

The frame 50 can be formed by a member having a frame shape and made ofa metal, an alloy, or a ceramic. Examples of the metals include Fe, Cu,Ni, Al, Ag, Au, Pt, Ti, W, and Pd. Examples of the alloys include alloyscontaining at least one of Fe, Cu, Ni, Al, Ag, Au, Pt, Ti, W, Pd, andthe like.

A resin material can be used for the frame. In this case, the membermade of a metal, an alloy, or a ceramic described above can be embeddedin the frame made of a resin material. Alternatively, the frame can havea portion made of a resin material and another portion made of a metal,an alloy, or a ceramic.

The light-emitting device 100 includes the plurality of first elementstructures 15. In the light-emitting device 100, a row of eleven firstelement structures 15 are held by the covering member 40. Meanwhile, thelight-emitting device can include ten or less first element structures15, or twelve or more first element structures 15.

Light-Emitting Module

Next, the light-emitting module 200 will be described below.

The light-emitting module 200 includes the light-emitting device 100 andthe module substrate 80.

When the light-emitting device 100 does not include the protectiveelement 25, it is preferable that the module substrate 80 includes theprotective element 25. The module substrate 80 can include electroniccomponents other than the protective element 25.

The light-emitting device 100 has the above-described configuration.

The module substrate 80 is a member on which the light-emitting device100 is disposed, and electrically connects the light-emitting device 100to external components. The module substrate 80 has, for example, asubstantially elongated-rectangular shape in a plan view. The modulesubstrate 80 includes a substrate portion 6 and third wiring portions 7.

Examples of materials for the substrate portion 6 include the materialslisted as examples for the base portion 2 of the submount substrate 10.Examples of materials for the third wiring portions 7 include thematerials listed as examples for the first wiring portions 3 of thesubmount substrate 10.

The light-emitting device 100 is disposed on an upper surface of themodule substrate 80 such that the second wiring portions 5 and the thirdwiring portions 7 are joined via electroconductive adhesives 8. Examplesof the electroconductive adhesives 8 include eutectic solder,electroconductive paste, and bumps. In the light-emitting module 200,the frame 50 has a height from the light-emitting surface of thelight-emitting device 100 to approximately the center of the baseportion 2 of the submount substrate 10. In the light-emitting module200, the covering member 40 is formed between the frame 50 and thesubmount substrate 10 to have an inclined surface. This allows thelight-emitting module 200 to have predetermined spaces between themodule substrate 80 and the frame 50, and between the module substrate80 and a surface of the covering member 40 between the frame 50 and thesubmount substrate 10.

Operation of Light-Emitting Module

When the light-emitting module 200 is driven, an electric current issupplied to each of the light-emitting elements 20 from an externalpower supply via the third wiring portions 7, the second wiring portions5, the inner wiring portions 4, and the first wiring portions 3, so thatthe light-emitting element 20 emits light. A portion of the lightemitted from the light-emitting elements 20 travels upward and isextracted to the outside toward above the light-emitting device 100 viathe light-transmissive member 30. A portion of the light travelingdownward is reflected at the covering member 40 and the submountsubstrate 10 and is extracted to the outside of the light-emittingdevice 100 via the light-transmissive member 30. A portion of the lighttraveling between the light-emitting elements 20 and the frame 50 isreflected at the covering member 40 and the frame 50 and is extracted tothe outside of the light-emitting device 100 via the light-transmissivemember 30. A portion of the light traveling between the light-emittingelements 20 is reflected at the covering member 40 and is extracted tothe outside of the light-emitting device 100 via the light-transmissivemember 30. In the case of using the light-emitting module 200 as a lightsource of a vehicle headlight, reduction of a distance between adjacentones of the light-transmissive members 30 (for example, 0.2 mm or less)allows the optical system to have a simple and compact structure.

Method of Manufacturing According to Embodiment

FIG. 2 is a flowchart illustrating a method of manufacturing thelight-emitting device according to the first embodiment. FIG. 3 is aflowchart illustrating a method of manufacturing the light-emittingmodule according to the first embodiment.

Method of Manufacturing Light-Emitting Device

One example of a method of manufacturing the light-emitting device 100will be described.

The method of manufacturing the light-emitting device 100 includes: astep S101 of providing a plurality of first element structures 15 eachof which includes a submount substrate 10, a light-emitting element 20,and a light-transmissive member 30 in this order; a step S102 of forminga frame to surround the first element structures 15 on a sheet member70; a step S103 of disposing the first element structures 15 such thatthe light-transmissive members 30 face the sheet member 70; a step S104of forming a covering member 40 on the sheet member 70 to cover at leasta portion of a lateral surface of the submount substrate 10 of each ofthe first element structures 15; and a step S105 of removing the sheetmember 70.

The step S101 of providing the first element structures includes a stepS101 a of providing a collective substrate 11 including a plurality ofsubmount regions 12 each of which constitutes a respective one of thesubmount substrates 10 after the collective substrate 11 is divided, astep S101 b of disposing the light-emitting elements 20 in the submountregions 12, a step S101 c of disposing the light-transmissive members 30on respective ones of light-emitting elements 20, and a step S101 d offorming the plurality of first element structures 15 by dividing thecollective substrate 11 for respective submount regions 12 into thefirst element structures 15.

The material, arrangement, and the like of each member are as describedfor the light-emitting device 100, and their duplicative descriptionsare omitted as appropriate.

Providing First Element Structures

In the step S101 of providing the first element structures, theplurality of first element structures 15 are provided, each of whichincludes the submount substrate 10, the light-emitting element 20, andthe light-transmissive member 30 in this order.

The step S101 includes the step S101 a of providing a collectivesubstrate, the step S101 b of disposing light-emitting elements, thestep S101 c of disposing light-transmissive members, and the step S101 dof forming first element structures.

Providing Collective Substrate

In the step S101 a of providing the collective substrate, the collectivesubstrate 11 is provided. The collective substrate 11 includes theplurality of submount regions 12, each of which constitutes the submountsubstrate 10 after the collective substrate 11 is divided.

The collective substrate 11 is a single substrate that includes thesubmount regions 12 on which light-emitting elements 20 are disposed.The collective substrate 11 shown in FIG. 4A includes four submountregions 12 for convenience; however, the number of the submount regions12 can be appropriately selected.

Mounting Light-Emitting Elements

In the step S101 b of disposing the light-emitting elements, thelight-emitting elements 20 are disposed in the submount regions 12.

In the step S101 b, as shown in FIG. 4A, each of a plurality oflight-emitting elements 20 is disposed on a respective one of thesubmount regions 12. The light-emitting elements 20 has an electrodeforming surface as a mounting surface and is flip-chip mounted on firstwiring portions that are disposed in the submount regions 12 via theelectroconductive adhesives.

At this time, each of the protective elements 25 is disposed on arespective one of the submount regions 12.

Disposing Light-Transmissive Member

In the step S101 c of disposing the light-transmissive members, each ofthe light-transmissive members 30 is disposed on a respective one of thelight-emitting elements 20.

In the step S101 c, as shown in FIG. 4B, for example, thelight-transmissive member 30 that has a predetermined shape is joined tothe upper surface of the light-emitting element 20 (that is, a mainlight extracting surface) that is opposite to the electrode formingsurface. The light-transmissive member 30 can be joined to thelight-emitting element 20 in a direct method or via a light-transmissivebonding member.

Forming First Element Structures

In the step S101 d of forming the first element structures, thecollective substrate 11 is divided for each submount region 12 to obtainthe plurality of first element structures 15.

In the step S101 d, as shown in FIG. 4C, the collective substrate 11 isdivided at predetermined positions to singulate into the plurality offirst element structures 15.

The light-emitting device 100 is manufactured using a combination of thesingulated first element structures 15. That is, selection of the firstelement structures 15 can be performed after the singulation into thefirst element structures 15, such that first element structures 15having light-emitting characteristics in a predetermined range areselected from the singulated first element structures 15 and are adesired combination of the selected first element structures 15 is usedfor the light-emitting device 100. Accordingly, the light-emittingdevice 100 having a desired emission color with a smaller unevenness inemission color can be obtained.

Also, if a defect occurs in some of the first element structures 15during manufacturing, only the defective first element structures 15 canbe discarded before the first element structures 15 are disposed on thesheet member 70. In the case of a light-emitting device in which aplurality of light-emitting elements are disposed on a single submountsubstrate, if a defect occurs in some members, the whole light-emittingdevice needs to be discarded. The method of manufacturing thelight-emitting device according to the embodiment can therefore reducethe number of members to be discarded if a defect is found duringmanufacturing.

Forming Frame

In the step S102 of forming the frame, as shown in FIG. 4D, the frame 50is formed on the sheet member 70 to surround the plurality of firstelement structures 15.

The frame 50 can be formed at a desired position on the sheet member 70using, for example, a frame-shaped member made of metals, alloys, orceramics.

Using metals, alloys, or ceramics for the frame 50 allows for reducingwarpage of the covering member 40. This allows the light-emitting device100 to have a flat mounting surface. In the case of using resinmaterials for the covering member 40, warpage may occur in thelight-emitting device 100 due to shrinkage of the resin while the resinis cured. However, the warpage can be reduced by using a non-flexiblematerial for the frame 50. This allows the light-emitting device 100 tohave a good mountability on the module substrate 80.

Further, the frame 50 can be formed before the step S103 of disposingthe first element structures. This allows the first element structures15 to be disposed on the sheet member 70 on the basis of the position ofthe frame 50. Accordingly, the first element structures 15 can beprecisely disposed on the sheet member 70 without alignment marks fordisposing the first element structures 15.

Mounting First Element Structure

In the step S103 of disposing the first element structures, theplurality of first element structures 15 are disposed such that thelight-transmissive members 30 face the sheet member 70. That is, thefirst element structures 15 are disposed on the sheet member 70 suchthat upper surfaces of the light-transmissive members 30 (that is,surfaces opposite to the surfaces on which the light-emitting elements20 are disposed) face an upper surface of the sheet member 70. After thesingulation, the singulated first element structures 15 are disposed onthe sheet member 70. For example, when a blade is used for thesingulation, the first element structures 15 are disposed with a smallerdistance between adjacent one of the first element structures 15 thanthe width of the blade. This allows the light-emitting device 100 tohave small intervals between adjacent ones of the light-emittingsurfaces.

In the step S103, as shown in FIGS. 4E and 4I, the first elementstructures 15 are disposed on the upper surface of the sheet member 70.The first element structures 15 are disposed on the upper surface of thesheet member 70 such that the upper surfaces of the light-transmissivemembers 30 serve as mounting surfaces.

Examples of the sheet member 70 known in the art include heat-resistantresin sheets.

Disposing the first element structures 15 such that the tipper surfaceof each light-transmissive member 30 faces the sheet member 70 allowsthe plurality of light-emitting surfaces of the light-emitting device100 to be located at a uniform height.

Forming Covering Member

In the step S104 of forming the covering member, the covering member 40is formed on the sheet member 70 to cover at least a portion of thelateral surface of the submount substrate 10 of each of the firstelement structures 15.

In the step S104, as shown in FIGS. 4F and 4J, the covering member 40 isformed inside the frame 50 such that the covering member 40 covers atleast a portion of the lateral surface of the submount substrate 10 ofthe first element structure 15.

In the step S104, an uncured resin material, which constitutes thecovering member 40, is disposed between the frame 50 and the firstelement structures 15, and between adjacent ones of the first elementstructures 15, by, for example, potting or spraying. Thereafter, theresin material is cured to form the covering member 40.

In the step S104, the covering member 40 is disposed to cover thelateral surfaces of the first element structure 15 (that is, the lateralsurfaces of the submount substrate 10, the lateral surfaces of thelight-emitting element 20, and the lateral surfaces of thelight-transmissive member 30) except a lower surface of the submountsubstrate 10. The lateral surfaces of the second wiring portion 5 arenot covered with the covering member 40. The covering member 40 can bedisposed to cover the lower surface of the submount substrate 10, andthen a portion of the covering member 40 can be removed by polishing,grinding, cutting, or the like, to expose the lower surface of thesubmount substrate 10, that is, the lower surface of the second wiringportion 5.

The covering member 40 is formed in a state where each of the firstelement structures 15 is disposed such that the upper surface of thelight-transmissive member 30 faces the sheet member 70. This allows theplurality of light-emitting surfaces in the light-emitting device 100and the upper surface of the covering member 40 between adjacent ones ofthe light-emitting surfaces to be substantially in the same plane.

Removing Sheet Member

In the step S105 of removing the sheet member, the sheet member 70 isremoved.

In the step S105, as shown in FIG. 4G, the sheet member 70 on which thefirst element structures 15 and the like are disposed is peeled off toform the light-emitting device 100.

The light-emitting device 100 obtained as described above has smallintervals between adjacent ones of the light-emitting surfaces, and thelight-emitting surfaces are located at substantially uniform height.This allows light distribution to be easily adjusted by the optics suchas lenses.

Method of Manufacturing Light-Emitting Module

Next, an example of a method of manufacturing the light-emitting module200 will be described.

The method of manufacturing the light-emitting module 200 includes astep S11 of providing the light-emitting device 100 using the method ofmanufacturing the light-emitting device 100, and a step S12 of disposingthe light-emitting device 100 such that the submount substrates 10 facethe module substrate 80.

The material, arrangement, and the like of each member are as describedfor the light-emitting module 200, and their duplicative descriptionsare omitted as appropriate.

Providing Light-Emitting Device

In the step S11 of providing the light-emitting device, thelight-emitting device 100 is provided using the method of manufacturingthe light-emitting device 100 described above.

In the step S11, the steps S101 to S105 described above are performed tomanufacture the light-emitting device 100.

Mounting Light-Emitting Device

In the step S12 of disposing the light-emitting device, thelight-emitting device 100 is disposed such that the submount substrates10 face the module substrate 80.

In the step S12, as shown in FIGS. 4H and 4K, the light-emitting device100 is disposed on the upper surface of the module substrate 80. Thelight-emitting device 100 has a mounting surface at the submountsubstrate 10 side, and is mounted on the upper surface of the modulesubstrate 80 via the electroconductive adhesives 8.

An upper surface of the frame 50 is located between the light-emittingsurface of the light-emitting device 100 and an approximate center ofthe base portion 2 of the submount substrate 10 in a height direction.Accordingly, upon disposing the light-emitting device 100 on the modulesubstrate 80, it is not necessary to consider adjustment of the heightby adjusting the amount of the electroconductive adhesives 8, whichwould be considered in the case in which the frame 50 is brought intocontact with the upper surface of the module substrate 80. Accordingly,the light-emitting device 100 is easily disposed on the upper surface ofthe module substrate 80.

While certain embodiments of the method of manufacturing thelight-emitting device, the method of manufacturing the light-emittingmodule, the light-emitting device, and the light-emitting module havebeen specifically described, the spirit of the present invention is notlimited to these descriptions and should be broadly interpreted on thebasis of the claims. The spirit of the present invention alsoencompasses various modifications based on these descriptions.

Other Embodiments

As shown in FIG. 5A, a light-emitting module 200A and a light-emittingdevice 100A include a frame 50A that is made of a resin containing areflective material.

Examples of the resin material for the frame 50A include the resinmaterials described above as examples of the resin material for thelight-transmissive member 30. Examples of the reflective material to becontained in the resin for the frame 50A include the reflectivematerials described above as examples of the reflective material to becontained in the resin for the covering member 40.

The frame 50A can be disposed at desired positions on the sheet member70 using, for example, a discharging device (i.e., a resin dischargingdevice) that can continuously discharge a liquid resin using airpressure (for example, see Japanese Unexamined Patent ApplicationPublication No. 2009-182307).

Alternatively, a resin molded body that has been processed to have aframe shape can be provided as the frame 50A and disposed at a desiredposition on the sheet member 70.

As shown in FIG. 5B, a light-emitting module 200B and a light-emittingdevice 100B include a frame 50B that has a substantiallyelongated-rectangular shape in a plan view and is made of a plurality ofdifferent materials. The frame 50B has an elongated-rectangular frameshape with two long sides and two short sides. The two long sides areformed by bar members 51 made of a material having rigidity higher thanrigidity of the covering member 40. The two short sides are formed byresin members 52 made of a resin containing a reflective material.Specific examples of the bar member 51 include metals, alloys, andceramics.

The frame 50B can be formed, for example, by disposing the bar member 51in a region of the long side of the elongated-rectangular shape anddisposing the resin member 52 in a region of the short side of theelongated-rectangular shape. The bar member 51 can be disposed only atone of the long sides of the elongated-rectangular shape.

As shown in FIG. 5C, a light-emitting module 200C and a light-emittingdevice 100C include a frame 50C that has a substantiallyelongated-rectangular frame shape in a plan view. Two long sides of theelongated-rectangular frame shape contain metals, alloys, or ceramics.Each of the two long sides is a bar member 51 made of a material havingrigidity higher than rigidity of the covering member 40. A resin member52 that is made of a resin containing a reflective material and has anelongated-rectangular shape is disposed to cover the bar member 51.

As shown in FIG. 5D, a light-emitting module 200D and a light-emittingdevice 100D include a frame 50D including the bar member 51 disposedonly at one of the long sides of the elongated-rectangular frame shape.Other portions are the same as the light-emitting module 200C and thelight-emitting device 100C.

Using the bar member(s) 51 for a portion(s) of the frame in thelight-emitting device allows for reducing warpage of the covering member40 that occurs when the covering member 40 is cured.

As shown in FIG. 5E, a light-emitting module 200E and a light-emittingdevice 100E include the plurality of first element structures 15disposed in a matrix. The first element structures 15 in this exampleare disposed in three rows, such that seven first element structures 15are arranged in a first row, nine first element structures 15 arearranged in a second row, and eleven first element structures 15 arearranged in a third row, that is, twenty-seven first element structures15 in total are disposed.

As shown in FIG. 5F, a light-emitting module 200F and a light-emittingdevice 100F include the plurality of first element structures 15disposed in a matrix of two rows and eleven columns. Each of outermostfirst element structures 15 of each row of the first element structures15 is located at a distance from a respective adjacent first elementstructure 15 in the row direction greater than a distance between twoadjacent ones of the other first element structures 15 in the rowdirection.

As shown in FIG. 5G, a light-emitting module 200G and a light-emittingdevice 100G include a combination of first element structures 15 thathave the light-emitting surfaces in different sizes. In FIG. 5G, thefirst element structures 15 having light-emitting surfaces of a smallersize are disposed at the central region of the light-emitting device100G in a matrix of two rows and six columns. Further, three firstelement structures 15 having light-emitting surfaces of a larger sizeare disposed at each of two opposite ends in the row direction of thematrix of the first element structures 15 having light-emitting surfacesof a smaller size. In the light-emitting module 200G and thelight-emitting device 100G, arranging the first element structures 15having smaller light-emitting surfaces at the central region allows thefirst element structures 15 to be more densely disposed compared withthe case in which the first element structures 15 having largerlight-emitting surfaces are disposed at the central region. With thedense arrangement of the first element structures 15 at the centralregion in the light-emitting device 100G included in the light-emittingmodule 200G, for example, in the case of using the light-emitting module200G for a light source of a vehicle headlight, a central area (mainlyon a road) can be more finely irradiated.

As shown in FIG. 5H, a light-emitting module 200H and a light-emittingdevice 100H include the plurality of first element structures 15disposed in two alternate rows. In FIG. 5H, the first element structures15 in a first row are offset from the first element structures 15 in asecond row in the row direction so that a gap between each first elementstructure 15 in the first row and a respective first element structure15 in the second row is 0 or less in the row direction. With the firstelement structures 15 that can be disposed with a gap of 0 or less inthe row direction in the light-emitting device 100H included in thelight-emitting module 200H, for example, in the case of using thelight-emitting module 200H for a light source of a vehicle headlight, alateral side can be more finely irradiated.

As described above, in the light-emitting module and the light-emittingdevice, any appropriate number of rows and columns of the first elementstructures 15 can be employed. The number of the first elementstructures 15 in each row and each column can be appropriately selectedaccording to the desired light distribution pattern. In thelight-emitting module and the light-emitting device, the combination ofthe first element structures 15 having the light-emitting surfaces indifferent sizes and the layout of the first element structures 15 can beappropriately selected according to the desired light-distributionpattern.

As shown in FIG. 6A, a light-emitting module 200I includes alight-emitting device 100I and the module substrate 80.

The light-emitting device 100I includes a plurality of second elementstructures 17 each of which includes the submount substrate 10, thelight-emitting element 20, and the light-transmissive member 30 that arelayered in this order and the covering member 40 that covers lateralsurfaces of each of the second element structures 17 to hold the secondelement structures 17. Each of the second element structures 17 includesthe protective element 25.

In short, the light-emitting device 100I mainly includes submountsubstrates 10, light-emitting elements 20, protective elements 25,light-transmissive members 30, and the covering member 40.

The second element structures 17 include a red element structure 17 athat emits red light, a blue element structure 17 b that emits bluelight, and a green element structure 17 c that emits green light. Thesecond element structures 17 are disposed in two rows and two columns.Two red element structures 17 a are disposed diagonally, and the blueelement structure 17 b and the green element structure 17 c are disposeddiagonally.

Each of the second element structures 17 is arranged such that theprotective element 25 is located outer side of the light-emitting device100I. This allows four light-transmissive members 30 to be disposed in amatrix with smaller intervals.

The red-light emitting element structure 17 a includes, for example, ablue light-emitting element 20 and a light-transmissive member 30containing a red phosphor. The blue-light emitting element structure 17b includes, for example, a blue light-emitting element 20 and alight-transmissive member 30 containing a diffusing material. Thegreen-light emitting element structure 17 c includes, for example, agreen light-emitting element 20 and a light-transmissive member 30containing a diffusing material. Alternatively, the green-light emittingelement structure 17 c includes, for example, a blue light-emittingelement 20 and a light-transmissive member 30 containing a greenphosphor.

The light-transmissive member 30 containing a red phosphor or a greenphosphor can be formed of a glass plate on which a resin layercontaining a phosphor or a glass layer containing a phosphor is formed.The light-transmissive member 30 containing a diffusing material can beformed of a glass plate on which a resin layer containing a diffusingmaterial or a glass layer containing a diffusing material is formed.

In the case of combining a plurality of element structures havingdifferent emission colors into the second element structures 17, withthe element structures disposed at approximately the same height,creeping up of the covering member 40 to the upper surface of thesubmount substrate 10 can be reduced. In each of the element structures,the amount of phosphors required to obtain a desired emission color canbe different, and the thickness of the resin layer can be differentdepending on the presence or absence of the phosphors. These differencescan be adjusted by adjusting the thickness of the glass plate.

The light-emitting module 200I includes the above-describedlight-emitting device 100I disposed on the module substrate 80.

Other configurations are the same as in the light-emitting module 200and the light-emitting device 100 in the first embodiment.

The light-emitting device can include one red-light emitting elementstructure 17 a, one blue-light emitting element structure 17 b, and onegreen-light emitting element structure 17 c. In the light-emittingdevice, the red-light emitting element structure 17 a, the blue-lightemitting element structure 17 b, and the green-light emitting elementstructure 17 c can be alternately disposed in a single line, or in amatrix. The light-emitting device can include an element structure thatemits white light and an element structure that emits amber light. Thelight-emitting device can include element structures each emitting lighthaving various emission colors obtained by selecting the wavelength ofthe light-emitting element 20 and the type and the ratio of phosphorscontained in the light-transmissive member 30. The element structurescan be disposed in a desired combination.

The light-emitting device and the light-emitting module described abovemay or may not include the frame. When the light-emitting device and thelight-emitting module include the frame, the frame can be disposedintermittently along an outer periphery of the light-emitting device.The frame can have a height from the light-emitting surface of thelight-emitting device to the second wiring portions of the submountsubstrate 10. In this case, in the light-emitting module, the frame canbe joined to the module substrate via an electroconductive adhesive.This allows heat generated by the light-emitting device to be dissipatedto the module substrate via the frame. Accordingly, the light-emittingmodule has a good heat dissipation. The frame can be joined to themodule substrate via a nonconductive adhesive, or can be disposed on themodule substrate without adhesives.

The submount substrate and the module substrate can have a substantiallysquare shape in a plan view. The frame can have a substantially squareshape in a plan view. The submount substrate, the module substrate, andthe frame can have other shapes.

The method of manufacturing the light-emitting device and the method ofmanufacturing the light-emitting module can include another step betweenthe steps or before or after the steps, as long as the additional stepdoes not adversely affect the other steps. For example, a foreign matterremoval step of removing foreign matters mixed during manufacturing canbe included.

In the step of providing the first element structures described above,each of the plurality of light-emitting elements 20 are disposed on arespective one of the submount substrates 10, and thereafter thelight-transmissive members 30 are disposed on the respectivelight-emitting elements 20. The light-transmissive members 30 can bedisposed on the light-emitting elements, and thereafter thelight-emitting elements 20 can be disposed on the submount substrates10. Also, the light-emitting elements 20 and the light-transmissivemembers 30 can be disposed on the submount substrates 10 after thecollective substrate 11 is divided.

In the method of manufacturing the light-emitting device and the methodof manufacturing the light-emitting module, the order of some steps isnot limited but can be changed. For example, in the above-describedmethod of manufacturing the light-emitting device, the step of formingthe frame is performed before the step of disposing the first elementstructures. However, the step of forming the frame can be performedafter the step of disposing the first element structures and before thestep of forming the covering member. Further, the step of forming theframe can be performed after a step of mounting the second elementstructures, or before the step of forming the covering member.Furthermore, the step of forming the frame can be performed before thestep of providing the first element structures.

The light-emitting device and the light-emitting module according to theembodiments of the present disclosure can be used for a light source ofan Adaptive Driving Beam (ADB) type headlight. Other applications of thelight-emitting device and the light-emitting module according to theembodiments of the present disclosure include light sources forbacklights of liquid-crystal displays, a variety of lightingapparatuses, large format displays, and various displays foradvertisements or destination guides, as well as digital video cameras,image scanners in apparatuses such as facsimile machines, copyingmachines, and scanners, projectors, and other apparatuses.

While certain embodiments of the method of manufacturing thelight-emitting device, the method of manufacturing the light-emittingmodule, the light-emitting device, and the light-emitting module havebeen specifically described, the spirit of the present invention is notlimited to these descriptions and should be broadly interpreted on thebasis of the claims. The spirit of the present invention alsoencompasses various modifications based on these descriptions.

What is claimed is:
 1. A light emitting device comprising: a pluralityof element structures, each of the plurality of element structurescomprises a light emitting element; a frame surrounding the plurality ofelement structures; and a covering member disposed on an inner side ofthe frame, the covering member is disposed between the frame and anelement structure of the plurality of element structures adjacent to theframe and between adjacent element structures of the plurality ofelement structures, wherein an upper surface and a lower surface of eachof the plurality of element structures are exposed from the coveringmember, wherein a lowest surface of the frame is exposed, and whereinthe upper surface of each of the plurality of element structures iscoplanar with an upper surface of the covering member and an uppersurface a the frame.
 2. The light emitting device according to claim 1,wherein the covering member has a portion located lower than the lowestsurface of the frame in a height direction.
 3. The light emitting deviceaccording to claim 1, wherein the light emitting device has arectangular shape that is elongated in a first direction in a plan view,and wherein the plurality of element structures are aligned in the firstdirection in the plan view.
 4. The light emitting device according toclaim 3, wherein, in the plan view, a center of each of the plurality ofelement structures is disposed offset in a second direction orthogonalto the first direction with respect, to a center axis of the rectangularshape in the first direction.
 5. The light emitting device according toclaim 4, wherein each of the plurality of element structures furtherincludes a protective element, and wherein the protective element isdisposed alongside a respective light emitting element in the seconddirection in the plan view.
 6. The light emitting device according toclaim 3, wherein each of the plurality of clement structures includes apair of wiring portions on the lower surface of the element structure,and wherein the pair of wiring portions are disposed adjacent to eachother in the first direction in the plan view.
 7. The light emittingdevice according to claim
 1. wherein a distance between the adjacentelement structures that are located on an upper surface of the lightemitting device is 0.2 mm or less.
 8. The light emitting deviceaccording to claim 1, wherein the covering member has an inclinedsurface between the frame and the element structure adjacent to theframe.
 9. The light emitting device according to claim 1, wherein eachof the plurality of element structures further includes alight-transmissive member disposed above the light emitting element, andwherein the light-transmissive member constitutes the upper surface ofthe element structure.
 10. The light emitting device according to claim1, wherein each of the plurality of element structures further includesa submount substrate disposed below the light emitting element, andwherein the submount substrate constitutes the lower surface of theelement structure.
 11. The light emitting device according to claim 1,wherein each of the plurality of element structures further includes asubmount substrate disposed below the light emitting element, andwherein the submount substrate constitutes the lower surface of theelement structure.
 12. The light emitting device according to claim 1,wherein the plurality of element structures includes a first elementstructure that emits white light and a second element structure thatemits amber light.
 13. The light emitting device according to claim 1,wherein the frame is made of metals, alloys, or ceramics.
 14. The lightemitting device according to claim 1, wherein the covering member is alight-reflective resin.
 15. A light emitting module comprising: a modulesubstrate; and the light emitting device according to claim 1, the lightemitting device is disposed on an upper surface of the module substrate.16. The light emitting module according to claim 15, wherein the frameis separated from the module substrate in a height direction.
 17. Thelight emitting module according to claim 15, wherein the covering memberis separated from the module substrate in a height direction.
 18. Thelight emitting module according to claim 15, wherein each of theplurality of element structures further includes a light-transmissivemember disposed above the light emitting element, wherein thelight-transmissive member constitutes the upper surface of the elementstructure, wherein each of the plurality of element structures furtherincludes a submount substrate disposed below the light emitting element,and wherein the submount substrate constitutes the lower surface of theelement structure.
 19. A light emitting device comprising: a pluralityof element structures, each of the plurality of element structurescomprises a light emitting element; a frame surrounding the plurality ofelement structures; and a covering member disposed on an inner side ofthe frame, the covering member is disposed between the Frame and anelement structure of the plurality of element structures adjacent to theframe and between adjacent element structures of the plurality ofelement structures, wherein an upper surface and a lower surface of eachof the plurality of element structures are exposed from the coveringmember, wherein a lowest surface of the frame is exposed, and whereinthe covering member has a portion located lower than the lowest surfaceof the frame in a height direction.
 20. A light emitting devicecomprising: a plurality of element structures, each of the plurality ofelement structures comprises a light emitting element; a framesurrounding the plurality of element structures; and a covering memberdisposed on an inner side of the frame, the covering member is disposedbetween the frame and an element structure of the plurality of elementstructures adjacent to the frame and between adjacent element structuresof the plurality of element structures, wherein an upper surface and alower surface of each of the plurality of element structures are exposedfrom the covering member, wherein a lowest surface of the frame isexposed, wherein the light emitting device has a rectangular shape thatis elongated in a first direction in a plan view, wherein the pluralityof element structures are aligned in the first direction in the planview, and wherein, in the plan view, a center of each of the pluralityof element structures is disposed offset in a second directionorthogonal to the first direction with respect to a center axis of therectangular shape in the first direction.